lead-free parts pb LSD3025-XX-PF doc. no : qw0905- rev. : a date : - 2007 03 - feb. single digit led display (0.3 inch) LSD3025-XX-PF data sheet ligitek electronics co.,ltd. property of ligitek only
? 0.45 typ 7.5 (0.295") 5.1 0.5 5.4 (0.21") 10(0.39") 19.0 (0.75") l s d 3 0 2 5 - x x - p f l i g i t e k pin no.1 a b c d e f g r.dp ? 0.9 2.54*6= 15.24(0.6") 7.62 (0.3") note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25(0.01") unless otherwise noted. 2.specifications are subject to change without notice. LSD3025-XX-PF package dimensions part no. ligitek electronics co.,ltd. property of ligitek only page 1/8
nc:6 1 1310872119 314 ab c def g r.dp LSD3025-XX-PF no pin:4,5,12 part no.LSD3025-XX-PF page ligitek electronics co.,ltd. property of ligitek only internal circuit diagram 2/8
cathode e nc no pin no pin common anode cathode f cathode a part no.LSD3025-XX-PF ligitek electronics co.,ltd. property of ligitek only pin no. 6 7 5 13 14 12 LSD3025-XX-PF 3 4 2 pin no. 1 10 11 9 8 electrical connection LSD3025-XX-PF 3/8 page common anode cathode d cathode rdp cathode g no pin cathode b cathode c
part selection and application information(ratings at 25) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. material gaalas chip LSD3025-XX-PF part no electrical common anode red 6601.5 20 2.4 1.8 p ( nm) common cathode or anode emittedmin. (nm) typ. max. vf(v) 2:1 2.354.0 iv-m typ. min. iv(mcd) reverse current per any chip operating temperature storage temperature solder temperature 1/16 inch below seating plane for 3 seconds at 260 peak forward current per chip (duty 1/10,0.1ms pulse width) power dissipation per chip forward current per chip absolute maximum ratings at ta=25 parameter i f ma 30 t opr tstg -25 ~ +85 -25 ~ +85 ir pd i fp 10 100 100 a mw ma ligitek electronics co.,ltd. property of ligitek only symbol ratings sr unit 4/8 page LSD3025-XX-PF part no.
luminous intensity matching ratio test condition for each parameter luminous intensity per chip peak wavelength forward voltage per chip spectral line half-width reverse current any chip nm ir iv-m a p iv nm mcd if=20ma vr=5v if=10ma if=20ma ligitek electronics co.,ltd. property of ligitek only parameter symbol vf unit volt test condition if=20ma page5/8 LSD3025-XX-PF part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -4040 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 sr chip page 6/8 LSD3025-XX-PF part no.
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 60 seconds max 0 25 0 120 temp( c) 260 50 preheat 2 /sec max 100 5 /sec max 260 c3sec max 150 time(sec) ligitek electronics co.,ltd. property of ligitek only page 7/8 LSD3025-XX-PF part no.
mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. solderability test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 ligitek electronics co.,ltd. property of ligitek only jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) solder resistance test thermal shock test low temperature storage test high temperature storage test high temperature high humidity test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) test condition reliability test: operating life test test item this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description reference standard page8/8 part no.LSD3025-XX-PF
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